Wafer Slicing Diamond Saw Blade from Canada
Precision diamond-impregnated saw blade for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It is a part of wafer preparation equipment under HTS 8475.90.90.00 for semiconductor manufacturing machines.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit blueprints proving blade specs match semiconductor wafer tolerances (e.g
• <100 micron kerf)
• Pair with boule slicing machine invoices to establish part-of-machine status
• Avoid misclassification by specifying 'not for general glass cutting' in docs