Wafer Slicing Diamond Saw Blade from Germany
Precision diamond-impregnated saw blade for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It is a part of wafer preparation equipment under HTS 8475.90.90.00 for semiconductor manufacturing machines.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit blueprints proving blade specs match semiconductor wafer tolerances (e.g
• <100 micron kerf)
• Pair with boule slicing machine invoices to establish part-of-machine status
• Avoid misclassification by specifying 'not for general glass cutting' in docs