8475.90.90.00/Wafer Slicing Diamond Saw Blade/Germany

Wafer Slicing Diamond Saw Blade from Germany

Precision diamond-impregnated saw blade for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It is a part of wafer preparation equipment under HTS 8475.90.90.00 for semiconductor manufacturing machines.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Submit blueprints proving blade specs match semiconductor wafer tolerances (e.g

• <100 micron kerf)

• Pair with boule slicing machine invoices to establish part-of-machine status

• Avoid misclassification by specifying 'not for general glass cutting' in docs