Wafer Slicing Diamond Saw Blade from Mexico
Precision diamond-impregnated saw blade for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It is a part of wafer preparation equipment under HTS 8475.90.90.00 for semiconductor manufacturing machines.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit blueprints proving blade specs match semiconductor wafer tolerances (e.g
• <100 micron kerf)
• Pair with boule slicing machine invoices to establish part-of-machine status
• Avoid misclassification by specifying 'not for general glass cutting' in docs