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8475.90.90.00/Wafer Slicing Diamond Saw Blade/Mexico

Wafer Slicing Diamond Saw Blade from Mexico

Precision diamond-impregnated saw blade for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It is a part of wafer preparation equipment under HTS 8475.90.90.00 for semiconductor manufacturing machines.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Submit blueprints proving blade specs match semiconductor wafer tolerances (e.g

• <100 micron kerf)

• Pair with boule slicing machine invoices to establish part-of-machine status

• Avoid misclassification by specifying 'not for general glass cutting' in docs

Wafer Slicing Diamond Saw Blade from Mexico — Import Duty Rate | HTS 8475.90.90.00