Gallium Arsenide Wafer Lapper Abrasive Pad
Specialized abrasive pad formulated for lapping compound-sensitive GaAs wafers in semiconductor grinder/lappers. Part for machinery processing solid mineral semiconductor substrates, HTS 8474.90.00.90.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general-purpose abrasive paper/cloth not machine-integrated
Natural/abrasive powders on base classify as articles, not machinery parts.
If imported as prepared lapping compounds/slurries
Organic composite solvents for grinding shift to chemical preparations chapter.
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Import Tips & Compliance
• Certify pad chemistry compatibility with GaAs (no copper contamination) for proper classification
• Ship with machine compatibility data to prevent generic abrasive reclassification
Related Products under HTS 8474.90.00.90
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High-precision diamond-impregnated saw blade used in wafer slicing saws to cut thin semiconductor wafers from monocrystalline silicon boules. As a replaceable part for machinery grinding and slicing solid mineral substances (silicon crystals), it is classified under HTS 8474.90.00.90 parts thereof.
Semiconductor Wafer Lapping Plate
Cast iron or ceramic lapping plate used in wafer grinders/lappers to achieve flatness tolerances on silicon wafers prior to fabrication. This part for grinding machinery of solid mineral substances (semiconductor wafers) is covered by HTS 8474.90.00.90.
Crystal Puller Shaft Assembly
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Precision spindle assembly for high-speed rotation in semiconductor wafer grinders, ensuring accurate grinding of wafer surfaces to tight tolerances. Part of grinding machinery for solid mineral semiconductor wafers under HTS 8474.90.00.90.
Float Zone Crystal Grinder Fixture
Custom fixture/holder for securing crystals during grinding in float zone semiconductor production equipment. Designed for machinery grinding solid mineral substances, falling under parts of HTS 8474.90.00.90.