Gallium Arsenide Wafer Lapper Abrasive Pad from Mexico
Specialized abrasive pad formulated for lapping compound-sensitive GaAs wafers in semiconductor grinder/lappers. Part for machinery processing solid mineral semiconductor substrates, HTS 8474.90.00.90.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify pad chemistry compatibility with GaAs (no copper contamination) for proper classification
• Ship with machine compatibility data to prevent generic abrasive reclassification