Other
Machinery for sorting, screening, separating, washing, crushing, grinding, mixing or kneading earth, stone, ores or other mineral substances, in solid (including powder or paste) form; machinery for agglomerating, shaping or molding solid mineral fuels, ceramic paste, unhardened cements, plastering materials or other mineral products in powder or paste form; machines for forming foundry molds of sand; parts thereof: > Parts > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8474.90.00.90
Silicon Crystal Boule Grinder
Industrial grinder designed to precisely grind silicon crystal boules to the required diameter for semiconductor wafer production, including flats indicating conductivity type and resistivity. Classified under HTS 8474.90.00.90 as grinding machinery for mineral substances in solid form, specifically for processing semiconductor materials like silicon. This equipment falls within the statistical notes for semiconductor manufacturing wafer preparation.
Wafer Slicing Diamond Saw Blade
High-precision diamond-impregnated saw blade used in wafer slicing saws to cut thin semiconductor wafers from monocrystalline silicon boules. As a replaceable part for machinery grinding and slicing solid mineral substances (silicon crystals), it is classified under HTS 8474.90.00.90 parts thereof.
Semiconductor Wafer Lapping Plate
Cast iron or ceramic lapping plate used in wafer grinders/lappers to achieve flatness tolerances on silicon wafers prior to fabrication. This part for grinding machinery of solid mineral substances (semiconductor wafers) is covered by HTS 8474.90.00.90.
Crystal Puller Shaft Assembly
Rotating shaft and support assembly part for Czochralski crystal pullers used to grow monocrystalline silicon boules from molten silicon. As a part of machinery processing mineral substances into semiconductor forms, classified under HTS 8474.90.00.90.
Wafer Grinder Spindle
Precision spindle assembly for high-speed rotation in semiconductor wafer grinders, ensuring accurate grinding of wafer surfaces to tight tolerances. Part of grinding machinery for solid mineral semiconductor wafers under HTS 8474.90.00.90.
Float Zone Crystal Grinder Fixture
Custom fixture/holder for securing crystals during grinding in float zone semiconductor production equipment. Designed for machinery grinding solid mineral substances, falling under parts of HTS 8474.90.00.90.
Silicon Wafer Edge Polisher Drum
Rotating drum component in wafer polishing equipment for smoothing edges of semiconductor wafers post-grinding. As a part for grinding/polishing solid mineral wafers, classified in HTS 8474.90.00.90.
Czochralski Boule Diameter Grinder
Specialized grinder head for reducing Czochralski-grown silicon boule diameter to wafer specifications. Essential part of semiconductor crystal processing machinery under HTS 8474.90.00.90 for mineral grinding.
Gallium Arsenide Wafer Lapper Abrasive Pad
Specialized abrasive pad formulated for lapping compound-sensitive GaAs wafers in semiconductor grinder/lappers. Part for machinery processing solid mineral semiconductor substrates, HTS 8474.90.00.90.
Semiconductor Crystal Grinder Coolant Nozzle
Precision coolant delivery nozzle for semiconductor crystal grinders, preventing thermal damage during high-precision grinding of silicon/GaAs boules. Classified as part of 8474 grinding machinery under HTS 8474.90.00.90.