Silicon Wafer Edge Polisher Drum
Rotating drum component in wafer polishing equipment for smoothing edges of semiconductor wafers post-grinding. As a part for grinding/polishing solid mineral wafers, classified in HTS 8474.90.00.90.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If drum constructed as agglomerated natural abrasives
Abrasive wheels of synthetic diamond fall under Chapter 68, separate from machinery parts.
If integrated with wafer testing profilometers
Testing equipment for semiconductor flatness classifies in optical/measuring chapter 90.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Specify edge profiling tolerances (microns) proving semiconductor precision requirements
• Bundle with related slurry delivery systems for cohesive classification evidence
Related Products under HTS 8474.90.00.90
Silicon Crystal Boule Grinder
Industrial grinder designed to precisely grind silicon crystal boules to the required diameter for semiconductor wafer production, including flats indicating conductivity type and resistivity. Classified under HTS 8474.90.00.90 as grinding machinery for mineral substances in solid form, specifically for processing semiconductor materials like silicon. This equipment falls within the statistical notes for semiconductor manufacturing wafer preparation.
Wafer Slicing Diamond Saw Blade
High-precision diamond-impregnated saw blade used in wafer slicing saws to cut thin semiconductor wafers from monocrystalline silicon boules. As a replaceable part for machinery grinding and slicing solid mineral substances (silicon crystals), it is classified under HTS 8474.90.00.90 parts thereof.
Semiconductor Wafer Lapping Plate
Cast iron or ceramic lapping plate used in wafer grinders/lappers to achieve flatness tolerances on silicon wafers prior to fabrication. This part for grinding machinery of solid mineral substances (semiconductor wafers) is covered by HTS 8474.90.00.90.
Crystal Puller Shaft Assembly
Rotating shaft and support assembly part for Czochralski crystal pullers used to grow monocrystalline silicon boules from molten silicon. As a part of machinery processing mineral substances into semiconductor forms, classified under HTS 8474.90.00.90.
Wafer Grinder Spindle
Precision spindle assembly for high-speed rotation in semiconductor wafer grinders, ensuring accurate grinding of wafer surfaces to tight tolerances. Part of grinding machinery for solid mineral semiconductor wafers under HTS 8474.90.00.90.
Float Zone Crystal Grinder Fixture
Custom fixture/holder for securing crystals during grinding in float zone semiconductor production equipment. Designed for machinery grinding solid mineral substances, falling under parts of HTS 8474.90.00.90.