Semiconductor Wafer Lapping Plate
Cast iron or ceramic lapping plate used in wafer grinders/lappers to achieve flatness tolerances on silicon wafers prior to fabrication. This part for grinding machinery of solid mineral substances (semiconductor wafers) is covered by HTS 8474.90.00.90.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If made primarily of agglomerated abrasives for general polishing
Millstones and grinding wheels of agglomerated abrasives fall under Chapter 68, not machinery parts.
If for parts of other unlisted semiconductor processing machines
Parts not specific to 8474 mineral machinery may go to residual provisions in 8479.
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Import Tips & Compliance
• Include surface flatness specs (<1 micron) and material certification to prove semiconductor application
• Pair with end-user statements from wafer fabs to support 8474 classification
Related Products under HTS 8474.90.00.90
Silicon Crystal Boule Grinder
Industrial grinder designed to precisely grind silicon crystal boules to the required diameter for semiconductor wafer production, including flats indicating conductivity type and resistivity. Classified under HTS 8474.90.00.90 as grinding machinery for mineral substances in solid form, specifically for processing semiconductor materials like silicon. This equipment falls within the statistical notes for semiconductor manufacturing wafer preparation.
Wafer Slicing Diamond Saw Blade
High-precision diamond-impregnated saw blade used in wafer slicing saws to cut thin semiconductor wafers from monocrystalline silicon boules. As a replaceable part for machinery grinding and slicing solid mineral substances (silicon crystals), it is classified under HTS 8474.90.00.90 parts thereof.
Crystal Puller Shaft Assembly
Rotating shaft and support assembly part for Czochralski crystal pullers used to grow monocrystalline silicon boules from molten silicon. As a part of machinery processing mineral substances into semiconductor forms, classified under HTS 8474.90.00.90.
Wafer Grinder Spindle
Precision spindle assembly for high-speed rotation in semiconductor wafer grinders, ensuring accurate grinding of wafer surfaces to tight tolerances. Part of grinding machinery for solid mineral semiconductor wafers under HTS 8474.90.00.90.
Float Zone Crystal Grinder Fixture
Custom fixture/holder for securing crystals during grinding in float zone semiconductor production equipment. Designed for machinery grinding solid mineral substances, falling under parts of HTS 8474.90.00.90.
Silicon Wafer Edge Polisher Drum
Rotating drum component in wafer polishing equipment for smoothing edges of semiconductor wafers post-grinding. As a part for grinding/polishing solid mineral wafers, classified in HTS 8474.90.00.90.