Gallium Arsenide Wafer Lapper Abrasive Pad from Japan
Specialized abrasive pad formulated for lapping compound-sensitive GaAs wafers in semiconductor grinder/lappers. Part for machinery processing solid mineral semiconductor substrates, HTS 8474.90.00.90.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Certify pad chemistry compatibility with GaAs (no copper contamination) for proper classification
• Ship with machine compatibility data to prevent generic abrasive reclassification