Wafer Edge Profiling Tool
Precision tool that bevels and rounds wafer edges to prevent chipping during handling and processing into semiconductor devices. Accessory solely for heading 8471 wafer prep machines. HTS 8473.30.51.00 applies to such non-CRT parts.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general milling cutters or tools
Hand or machine tools of Chapter 82 without semiconductor use.
If parts for dividing or finishing metal
Applies to general metal processing, not wafers.
If with primary edge defect inspection function
Measuring/testing equipment under Chapter 90.
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Import Tips & Compliance
• Specify edge profiles (e.g
• 'shark fin' for 300mm wafers) in technical data
• Link to specific 8471 equipment models in import declarations
Related Products under HTS 8473.30.51.00
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Robotic arm accessory for automated transfer of heavy semiconductor crystal ingots between processing stations in 8471 machines. Ensures precise alignment without contamination. Fits HTS 8473.30.51.00 as principal part without CRT.
Boule Diameter Control Sensor Mount
Mounting fixture for laser interferometers that monitor crystal boule diameter growth in real-time during Czochralski pulling. Accessory principally for heading 8471 crystal growers. Classifies HTS 8473.30.51.00 excluding CRT.
Czochralski Crystal Puller Furnace
A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules for semiconductor wafers. This part is suitable solely for machines of heading 8471 used in semiconductor manufacturing. It falls under HTS 8473.30.51.00 as a specialized accessory for crystal growing equipment.
Float Zone Crystal Grower Chamber
A vacuum chamber component for float zone method to produce high-purity silicon crystals from polycrystalline rods. Designed principally for semiconductor boule manufacturing machines under heading 8471. Classified in HTS 8473.30.51.00 as it excludes CRT and is a dedicated accessory.
Semiconductor Crystal Boule Grinder
Precision grinder that shapes crystal boules to exact diameters and adds flats indicating conductivity and resistivity for wafer production. Accessory solely for heading 8471 wafer preparation machines. HTS 8473.30.51.00 applies as parts without CRT for semiconductor processing.
Wafer Slicing Diamond Saw Blade
Ultra-thin diamond-impregnated saw blade for slicing monocrystalline boules into thin semiconductor wafers with minimal kerf loss. Part principally for 8471 wafer slicing machines. Fits HTS 8473.30.51.00 as specialized accessory without CRT.