Wafer Edge Profiling Tool from Mexico
Precision tool that bevels and rounds wafer edges to prevent chipping during handling and processing into semiconductor devices. Accessory solely for heading 8471 wafer prep machines. HTS 8473.30.51.00 applies to such non-CRT parts.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Specify edge profiles (e.g
• 'shark fin' for 300mm wafers) in technical data
• Link to specific 8471 equipment models in import declarations