Other
Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472: > Parts and accessories of the machines of heading 8471: > Not incorporating a cathode ray tube: > Other
Duty Rate (from China)
Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Products classified under HTS 8473.30.51.00
Crystal Ingot Handling Manipulator
Robotic arm accessory for automated transfer of heavy semiconductor crystal ingots between processing stations in 8471 machines. Ensures precise alignment without contamination. Fits HTS 8473.30.51.00 as principal part without CRT.
Boule Diameter Control Sensor Mount
Mounting fixture for laser interferometers that monitor crystal boule diameter growth in real-time during Czochralski pulling. Accessory principally for heading 8471 crystal growers. Classifies HTS 8473.30.51.00 excluding CRT.
Czochralski Crystal Puller Furnace
A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules for semiconductor wafers. This part is suitable solely for machines of heading 8471 used in semiconductor manufacturing. It falls under HTS 8473.30.51.00 as a specialized accessory for crystal growing equipment.
Float Zone Crystal Grower Chamber
A vacuum chamber component for float zone method to produce high-purity silicon crystals from polycrystalline rods. Designed principally for semiconductor boule manufacturing machines under heading 8471. Classified in HTS 8473.30.51.00 as it excludes CRT and is a dedicated accessory.
Semiconductor Crystal Boule Grinder
Precision grinder that shapes crystal boules to exact diameters and adds flats indicating conductivity and resistivity for wafer production. Accessory solely for heading 8471 wafer preparation machines. HTS 8473.30.51.00 applies as parts without CRT for semiconductor processing.
Wafer Slicing Diamond Saw Blade
Ultra-thin diamond-impregnated saw blade for slicing monocrystalline boules into thin semiconductor wafers with minimal kerf loss. Part principally for 8471 wafer slicing machines. Fits HTS 8473.30.51.00 as specialized accessory without CRT.
Silicon Wafer Lapping Plate
Cast iron or copper plate used with abrasive slurries to lap semiconductor wafers to precise flatness tolerances before polishing. Accessory for heading 8471 wafer preparation equipment. HTS 8473.30.51.00 for non-CRT parts in semiconductor processing.
Semiconductor Wafer Polishing Head
Carrier head assembly that holds and rotates wafers against polishing pads to achieve mirror surface finish required for device fabrication. Principal part for 8471 wafer polishers. Classifies under HTS 8473.30.51.00 as dedicated semiconductor accessory.
Wafer Edge Profiling Tool
Precision tool that bevels and rounds wafer edges to prevent chipping during handling and processing into semiconductor devices. Accessory solely for heading 8471 wafer prep machines. HTS 8473.30.51.00 applies to such non-CRT parts.
Semiconductor Wafer Flattening Fixture
Vacuum chuck fixture that secures wafers during lapping to achieve total indicated runout (TIR) specifications for device fabrication. Part for heading 8471 preparation machines. HTS 8473.30.51.00 for such specialized semiconductor accessories.