Semiconductor Wafer Polishing Head
Carrier head assembly that holds and rotates wafers against polishing pads to achieve mirror surface finish required for device fabrication. Principal part for 8471 wafer polishers. Classifies under HTS 8473.30.51.00 as dedicated semiconductor accessory.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general transmission shafts or cranks
Mechanical parts shift to 8483 if not semiconductor-specific.
If other lab microscopes or diffractions
Chapter 90 if polishing integrates inspection optics.
If sold as complete polishing system rather than part
Finished machines classify under 8471 if imported assembled.
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Import Tips & Compliance
• Document polishing pressure and pad compatibility for 300mm+ wafers
• Ensure no optical/CRT features; specify mechanical polishing function
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