Semiconductor Wafer Polishing Head from Japan
Carrier head assembly that holds and rotates wafers against polishing pads to achieve mirror surface finish required for device fabrication. Principal part for 8471 wafer polishers. Classifies under HTS 8473.30.51.00 as dedicated semiconductor accessory.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Document polishing pressure and pad compatibility for 300mm+ wafers
• Ensure no optical/CRT features; specify mechanical polishing function