Wafer Slicing Diamond Saw Blade
Ultra-thin diamond-impregnated saw blade for slicing monocrystalline boules into thin semiconductor wafers with minimal kerf loss. Part principally for 8471 wafer slicing machines. Fits HTS 8473.30.51.00 as specialized accessory without CRT.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If bandsaw or circular saw blades for general materials
Chapter 82 tools if not specialized for semiconductor wafer slicing.
If interchangeable tools for multiple machine types
Other interchangeable tools if lacking principal 8471 specificity.
If with integrated precision measurement for testing
Measuring instruments classify under 9031 if primary function is gauging.
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Import Tips & Compliance
• Specify diamond grit size and wafer thickness compatibility in import docs
• Prove sole use with semiconductor saws via OEM specs to maintain classification
Related Products under HTS 8473.30.51.00
Crystal Ingot Handling Manipulator
Robotic arm accessory for automated transfer of heavy semiconductor crystal ingots between processing stations in 8471 machines. Ensures precise alignment without contamination. Fits HTS 8473.30.51.00 as principal part without CRT.
Boule Diameter Control Sensor Mount
Mounting fixture for laser interferometers that monitor crystal boule diameter growth in real-time during Czochralski pulling. Accessory principally for heading 8471 crystal growers. Classifies HTS 8473.30.51.00 excluding CRT.
Czochralski Crystal Puller Furnace
A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules for semiconductor wafers. This part is suitable solely for machines of heading 8471 used in semiconductor manufacturing. It falls under HTS 8473.30.51.00 as a specialized accessory for crystal growing equipment.
Float Zone Crystal Grower Chamber
A vacuum chamber component for float zone method to produce high-purity silicon crystals from polycrystalline rods. Designed principally for semiconductor boule manufacturing machines under heading 8471. Classified in HTS 8473.30.51.00 as it excludes CRT and is a dedicated accessory.
Semiconductor Crystal Boule Grinder
Precision grinder that shapes crystal boules to exact diameters and adds flats indicating conductivity and resistivity for wafer production. Accessory solely for heading 8471 wafer preparation machines. HTS 8473.30.51.00 applies as parts without CRT for semiconductor processing.
Silicon Wafer Lapping Plate
Cast iron or copper plate used with abrasive slurries to lap semiconductor wafers to precise flatness tolerances before polishing. Accessory for heading 8471 wafer preparation equipment. HTS 8473.30.51.00 for non-CRT parts in semiconductor processing.