Wafer Slicing Diamond Saw Blade from Mexico
Ultra-thin diamond-impregnated saw blade for slicing monocrystalline boules into thin semiconductor wafers with minimal kerf loss. Part principally for 8471 wafer slicing machines. Fits HTS 8473.30.51.00 as specialized accessory without CRT.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Specify diamond grit size and wafer thickness compatibility in import docs
• Prove sole use with semiconductor saws via OEM specs to maintain classification