Semiconductor Wafer Polishing Head from Germany
Carrier head assembly that holds and rotates wafers against polishing pads to achieve mirror surface finish required for device fabrication. Principal part for 8471 wafer polishers. Classifies under HTS 8473.30.51.00 as dedicated semiconductor accessory.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document polishing pressure and pad compatibility for 300mm+ wafers
• Ensure no optical/CRT features; specify mechanical polishing function