8473.30.51.00/Wafer Edge Profiling Tool/Germany

Wafer Edge Profiling Tool from Germany

Precision tool that bevels and rounds wafer edges to prevent chipping during handling and processing into semiconductor devices. Accessory solely for heading 8471 wafer prep machines. HTS 8473.30.51.00 applies to such non-CRT parts.

Duty Rate — Germany → United States

25%

Rate breakdown

9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Specify edge profiles (e.g

• 'shark fin' for 300mm wafers) in technical data

• Link to specific 8471 equipment models in import declarations