Wafer Lapping Machine
Automated lapping equipment that uses abrasive slurries to achieve flatness tolerances on semiconductor wafers prior to polishing. Prepares wafer surfaces for photolithography. Under HTS 8468.80.5000 for its role in precision surface processing of semiconductor materials.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | +35.0% | 35% |
| 🇲🇽Mexico | Free | +10.0% | 10% |
| 🇨🇦Canada | Free | +10.0% | 10% |
| 🇩🇪Germany | Free | +10.0% | 10% |
| 🇯🇵Japan | Free | +10.0% | 10% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If lapping for general industrial surfaces
Generic lapping/polishing machines go to 8460 without semiconductor precision.
If sold as complete wafer processing line
Unspecified machines for semiconductor processing may use 8479.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Certify flatness specs (e.g
• <1 micron); ensure slurry compatibility docs
• Common issue: bulk import without fab qualification leads to 8480 classification
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