Other
Machinery and apparatus for soldering, brazing or welding, whether or not capable of cutting, other than those of heading 8515; gas-operated surface tempering machines and appliances; parts thereof: > Other machinery and apparatus: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8468.80.50.00
Semiconductor Crystal Annealer
Rapid thermal annealer using welding-like high-temp processing to relieve stresses in grown semiconductor crystals post-pulling. Improves yield. Fits HTS 8468.80.5000 as tempering appliance for semiconductor surfaces.
Crystal Puller for Semiconductor Wafer Production
A Czochralski method crystal puller used to grow monocrystalline silicon boules from which semiconductor wafers are sliced. It employs precise temperature control and rotation mechanisms to produce high-purity crystals essential for semiconductor manufacturing. Classified under HTS 8468.80.5000 as specialized apparatus involving high-temperature processing akin to welding or brazing in semiconductor boule formation.
Float Zone Crystal Grower
Float zone apparatus for producing monocrystalline semiconductor boules using zone melting without a crucible, ideal for high-purity silicon and gallium arsenide. It features RF heating coils for localized melting zones. Falls under HTS 8468.80.5000 due to its specialized high-temperature processing for semiconductor materials.
Crystal Boule Grinder
Precision grinder for semiconductor crystal boules, shaping to exact wafer diameters and grinding flats to indicate conductivity type and resistivity. Essential wafer preparation equipment post-growth. HTS 8468.80.5000 covers it as specialized grinding apparatus in semiconductor processing chain.
Semiconductor Wafer Slicing Saw
High-precision diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Critical for wafer preparation in device fabrication. Classified in HTS 8468.80.5000 as specialized cutting apparatus integral to semiconductor processing.
Wafer Lapping Machine
Automated lapping equipment that uses abrasive slurries to achieve flatness tolerances on semiconductor wafers prior to polishing. Prepares wafer surfaces for photolithography. Under HTS 8468.80.5000 for its role in precision surface processing of semiconductor materials.
Semiconductor Wafer Polisher
Chemical-mechanical planarization (CMP) polisher for final surface finishing of semiconductor wafers, achieving mirror-like flatness for circuit fabrication. Uses polishing pads and slurries. HTS 8468.80.5000 applies to this critical apparatus in wafer preparation.
RF Heating Zone Refiner
Radio frequency zone refiner for purifying semiconductor polycrystals into monocrystalline form via repeated zone passes. Used in float zone processes for ultra-high purity. Fits HTS 8468.80.5000 as gas-operated or high-temp apparatus for semiconductor tempering.
Boule Diameter Grinder
Precision grinder specifically for reducing semiconductor boule diameter to standard wafer sizes (e.g., 300mm) while maintaining roundness. Includes automated gauging. HTS 8468.80.5000 for semiconductor-specific grinding apparatus.
Multi-Wire Wafer Slicer
Diamond multi-wire saw for simultaneous slicing of hundreds of semiconductor wafers from a single boule, minimizing material waste. High-speed for production volumes. Classified under HTS 8468.80.5000 as advanced cutting machinery for semiconductor wafers.
Double-Sided Wafer Lapper
Machine for simultaneous lapping of both wafer sides using planetary motion carriers, achieving total thickness variation (TTV) under 1 micron. Vital for advanced nodes. HTS 8468.80.5000 for precision semiconductor surface apparatus.
Chemical Mechanical Wafer Polisher
CMP polisher with integrated slurry dispense and endpoint detection for uniform planarization across 300mm semiconductor wafers. Used in front-end processing. Under HTS 8468.80.5000 as specialized polishing apparatus.
Crystal boule Flattener
Apparatus grinding orientation flats on semiconductor boules to denote doping type (P/N) and resistivity for wafer identification. Laser-guided precision. HTS 8468.80.5000 for semiconductor preparation machinery.
High-Purity Silicon Wafer Edge Grinder
Edge profiling grinder for semiconductor wafers to prevent chipping and enable handling, creating chamfers with specific radii. Post-slicing essential. Classified HTS 8468.80.5000 as wafer processing apparatus.
Automated Wafer Grinder for Backside
Back-grinding machine reducing semiconductor wafer thickness from 775 microns to <100 microns for 3D packaging, with tape mounting. Production critical. HTS 8468.80.5000 covers grinding in semiconductor workflow.