Float Zone Crystal Grower
Float zone apparatus for producing monocrystalline semiconductor boules using zone melting without a crucible, ideal for high-purity silicon and gallium arsenide. It features RF heating coils for localized melting zones. Falls under HTS 8468.80.5000 due to its specialized high-temperature processing for semiconductor materials.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | +35.0% | 35% |
| 🇲🇽Mexico | Free | +10.0% | 10% |
| 🇨🇦Canada | Free | +10.0% | 10% |
| 🇩🇪Germany | Free | +10.0% | 10% |
| 🇯🇵Japan | Free | +10.0% | 10% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If equipped with industrial induction heating only
Induction furnaces without crystal growth specificity go to 8514 for heating apparatus.
If for laboratory-scale testing rather than production
Lab testing machines shift to Chapter 90 provisions.
Not sure which classification is right?
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Import Tips & Compliance
• Include process flow diagrams showing semiconductor end-use; ensure compliance with export control docs for high-tech gear
• Pitfall: mislabeling as general lab equipment triggers higher duties
Related Products under HTS 8468.80.50.00
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Crystal Puller for Semiconductor Wafer Production
A Czochralski method crystal puller used to grow monocrystalline silicon boules from which semiconductor wafers are sliced. It employs precise temperature control and rotation mechanisms to produce high-purity crystals essential for semiconductor manufacturing. Classified under HTS 8468.80.5000 as specialized apparatus involving high-temperature processing akin to welding or brazing in semiconductor boule formation.
Crystal Boule Grinder
Precision grinder for semiconductor crystal boules, shaping to exact wafer diameters and grinding flats to indicate conductivity type and resistivity. Essential wafer preparation equipment post-growth. HTS 8468.80.5000 covers it as specialized grinding apparatus in semiconductor processing chain.
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High-precision diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Critical for wafer preparation in device fabrication. Classified in HTS 8468.80.5000 as specialized cutting apparatus integral to semiconductor processing.
Wafer Lapping Machine
Automated lapping equipment that uses abrasive slurries to achieve flatness tolerances on semiconductor wafers prior to polishing. Prepares wafer surfaces for photolithography. Under HTS 8468.80.5000 for its role in precision surface processing of semiconductor materials.
Semiconductor Wafer Polisher
Chemical-mechanical planarization (CMP) polisher for final surface finishing of semiconductor wafers, achieving mirror-like flatness for circuit fabrication. Uses polishing pads and slurries. HTS 8468.80.5000 applies to this critical apparatus in wafer preparation.