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8468.80.50.00/Wafer Lapping Machine/Canada

Wafer Lapping Machine from Canada

Automated lapping equipment that uses abrasive slurries to achieve flatness tolerances on semiconductor wafers prior to polishing. Prepares wafer surfaces for photolithography. Under HTS 8468.80.5000 for its role in precision surface processing of semiconductor materials.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Certify flatness specs (e.g

• <1 micron); ensure slurry compatibility docs

• Common issue: bulk import without fab qualification leads to 8480 classification

Wafer Lapping Machine from Canada — Import Duty Rate | HTS 8468.80.50.00