8468.80.50.00/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Automated lapping equipment that uses abrasive slurries to achieve flatness tolerances on semiconductor wafers prior to polishing. Prepares wafer surfaces for photolithography. Under HTS 8468.80.5000 for its role in precision surface processing of semiconductor materials.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Certify flatness specs (e.g

• <1 micron); ensure slurry compatibility docs

• Common issue: bulk import without fab qualification leads to 8480 classification