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Pneumatic Wafer Grinding Spindle

A pneumatic-powered spindle assembly designed as a replaceable part for wafer grinders used in semiconductor manufacturing to achieve precise wafer thickness. It falls under HTS 8467.99.0190 as a part of a pneumatic hand tool specialized for processing semiconductor wafers from crystal boules.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+37.5%37.5%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+12.5%12.5%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

9031.49Lower: 12.5% vs 37.5%

If integrated with precision measuring gauges

Measuring or checking instruments for semiconductor testing fall under Chapter 90, not hand tool parts.

8487.90.00Higher: 41.4% vs 37.5%

If for interchangeable machinery components not hand-held

Parts for semiconductor fab machines shift to Chapter 84 machinery headings outside hand tools.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Verify compatibility with US semiconductor equipment standards like SEMI specs; provide detailed engineering drawings for classification; watch for anti-dumping duties on precision tooling