Pneumatic Wafer Grinding Spindle

A pneumatic-powered spindle assembly designed as a replaceable part for wafer grinders used in semiconductor manufacturing to achieve precise wafer thickness. It falls under HTS 8467.99.0190 as a part of a pneumatic hand tool specialized for processing semiconductor wafers from crystal boules.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

9031.49Lower: 10% vs 35%

If integrated with precision measuring gauges

Measuring or checking instruments for semiconductor testing fall under Chapter 90, not hand tool parts.

8487.90.00Higher: 38.9% vs 35%

If for interchangeable machinery components not hand-held

Parts for semiconductor fab machines shift to Chapter 84 machinery headings outside hand tools.

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Import Tips & Compliance

Verify compatibility with US semiconductor equipment standards like SEMI specs; provide detailed engineering drawings for classification; watch for anti-dumping duties on precision tooling