Pneumatic Wafer Grinding Spindle from Germany
A pneumatic-powered spindle assembly designed as a replaceable part for wafer grinders used in semiconductor manufacturing to achieve precise wafer thickness. It falls under HTS 8467.99.0190 as a part of a pneumatic hand tool specialized for processing semiconductor wafers from crystal boules.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Verify compatibility with US semiconductor equipment standards like SEMI specs; provide detailed engineering drawings for classification; watch for anti-dumping duties on precision tooling