Other

Tools for working in the hand, pneumatic, hydraulic or with self-contained electric or nonelectric motor, and parts thereof: > Parts: > Other > Other

Duty Rate (from China)

35%
MFN Base RateFree

Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)

Total Effective Rate35%

Products classified under HTS 8467.99.01.90

Pneumatic Wafer Grinding Spindle

A pneumatic-powered spindle assembly designed as a replaceable part for wafer grinders used in semiconductor manufacturing to achieve precise wafer thickness. It falls under HTS 8467.99.0190 as a part of a pneumatic hand tool specialized for processing semiconductor wafers from crystal boules.

Hydraulic Crystal Boule Grinder Chuck

Hydraulic chuck part for holding crystal boules during grinding to exact diameters in semiconductor wafer prep equipment, classified as a hydraulic hand tool part under HTS 8467.99.0190.

Electric Wafer Lapping Motor Housing

Self-contained electric motor housing replacement part for wafer lappers that flatten semiconductor wafers to tight tolerances, under HTS 8467.99.0190 for electric hand tool parts.

Pneumatic Wafer Slicing Saw Arbor

Pneumatic arbor shaft for diamond wafer slicing saws that cut monocrystalline boules into thin wafers, a hand tool part under HTS 8467.99.0190 for semiconductor processing.

Cordless Battery-Powered Wafer Polisher Head

Replaceable polishing head for self-contained electric wafer polishers ensuring mirror-flat surfaces on semiconductor wafers prior to fabrication, HTS 8467.99.0190.

Hydraulic Crystal Puller Tension Arm

Hydraulic tension arm part for Czochralski crystal pullers adapted for hand-held grinding adjustments in semiconductor boule processing, under HTS 8467.99.0190.

Electric Float Zone Crystal Grinder Rotor

Electric rotor assembly for grinders processing float zone semiconductor crystals, part of self-contained motor hand tools under HTS 8467.99.0190.

Pneumatic Wafer Edge Profiling Nozzle

Pneumatic nozzle for edge profiling tools that shape wafer edges post-slicing for semiconductor handling, HTS 8467.99.0190 part.

Self-Contained Wafer Flattening Pneumatic Actuator

Pneumatic actuator for hand-held wafer flattening tools critical for surface flatness in semiconductor processing, under HTS 8467.99.0190.

Cordless Crystal Flat Grinder Collet

Collet chuck for cordless electric grinders that mill flats on semiconductor crystal boules to indicate resistivity, HTS 8467.99.0190.