Pneumatic Wafer Grinding Spindle from Japan
A pneumatic-powered spindle assembly designed as a replaceable part for wafer grinders used in semiconductor manufacturing to achieve precise wafer thickness. It falls under HTS 8467.99.0190 as a part of a pneumatic hand tool specialized for processing semiconductor wafers from crystal boules.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Verify compatibility with US semiconductor equipment standards like SEMI specs; provide detailed engineering drawings for classification; watch for anti-dumping duties on precision tooling