Precision Lapper Work Table
Granite/steel work table for wafer lappers maintaining nanometer flatness in prep process. For heading 8463 lapping machines, HTS 8466.94.85.85. Meets statistical note requirements for wafer dimensional tolerances.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If granite surface plates imported separately
Worked monumental stone classifies under Chapter 68 regardless of end use.
If steel tables without semiconductor-specific tolerances
General steel articles shift to other steel products heading.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Certify flatness to lambda/10 (5nm) with interferometry test reports
• Specify kinematic mounting for wafer cassette interface
Related Products under HTS 8466.94.85.85
CNC Lathe Spindle Motor
High-precision spindle motor designed specifically for CNC lathes under heading 8462, providing rotational power to the chuck holding the workpiece. It falls under HTS 8466.94.85.85 as a part suitable solely or principally for use with machine tools of heading 8462. Essential for high-speed machining operations in semiconductor wafer preparation equipment.
Wafer Grinder Spindle Assembly
Precision spindle assembly for wafer grinders used in semiconductor boule preparation, compatible with grinding machines of heading 8463. Classified under 8466.94.85.85 as an accessory principally for heading 8463 machines. Critical for achieving flatness tolerances in crystal grinding per statistical notes.
Crystal Puller Tool Holder
Specialized tool holder for crystal pullers in Czochralski method equipment under heading 8462, holding seed crystals during boule growth. Falls under HTS 8466.94.85.85 as a work/tool holder for 8462 machines. Designed for extreme temperature/precision environments in semiconductor manufacturing.
CNC Grinder Workhead
Complete workhead assembly for CNC grinding machines of heading 8463 used in wafer lapping/polishing prep. Under HTS 8466.94.85.85 as part principally for 8463 grinders. Provides precise rotational control for semiconductor surface flatness.
Wafer Polisher Quill Assembly
Quill/spindle assembly for wafer polishers bringing surfaces to semiconductor fabrication tolerances. For heading 8463 polishing machines, classified 8466.94.85.85. Critical for flatness specs in statistical note wafer preparation equipment.
Czochralski Crystal Seed Chuck
Rotating seed chuck for Czochralski crystal pullers under heading 8462. HTS 8466.94.85.85 as work holder for boule growers. Temperature-controlled interface prevents crystal defects during growth initiation.