Other
Parts and accessories suitable for use solely or principally with the machines of headings 8456 to 8465, including work or tool holders, self-opening dieheads, dividing heads and other special attachments for the machines; tool holders for any type of tool for working in the hand: > Other: > For machines of heading 8462 or 8463: > Other > Other > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8466.94.85.85
CNC Lathe Spindle Motor
High-precision spindle motor designed specifically for CNC lathes under heading 8462, providing rotational power to the chuck holding the workpiece. It falls under HTS 8466.94.85.85 as a part suitable solely or principally for use with machine tools of heading 8462. Essential for high-speed machining operations in semiconductor wafer preparation equipment.
Wafer Grinder Spindle Assembly
Precision spindle assembly for wafer grinders used in semiconductor boule preparation, compatible with grinding machines of heading 8463. Classified under 8466.94.85.85 as an accessory principally for heading 8463 machines. Critical for achieving flatness tolerances in crystal grinding per statistical notes.
Crystal Puller Tool Holder
Specialized tool holder for crystal pullers in Czochralski method equipment under heading 8462, holding seed crystals during boule growth. Falls under HTS 8466.94.85.85 as a work/tool holder for 8462 machines. Designed for extreme temperature/precision environments in semiconductor manufacturing.
CNC Grinder Workhead
Complete workhead assembly for CNC grinding machines of heading 8463 used in wafer lapping/polishing prep. Under HTS 8466.94.85.85 as part principally for 8463 grinders. Provides precise rotational control for semiconductor surface flatness.
Wafer Polisher Quill Assembly
Quill/spindle assembly for wafer polishers bringing surfaces to semiconductor fabrication tolerances. For heading 8463 polishing machines, classified 8466.94.85.85. Critical for flatness specs in statistical note wafer preparation equipment.
Czochralski Crystal Seed Chuck
Rotating seed chuck for Czochralski crystal pullers under heading 8462. HTS 8466.94.85.85 as work holder for boule growers. Temperature-controlled interface prevents crystal defects during growth initiation.
Wafer Slicing Saw Arbor
Diamond-impregnated arbor for wafer slicing saws under heading 8463, used to slice monocrystalline boules into wafers. Classified in 8466.94.85.85 as special attachment for 8463 sawing machines. Meets tolerances for semiconductor wafer thickness per statistical notes.
Dividing Head for Wafer Machines
Precision dividing head for indexing in multi-axis wafer grinding machines under heading 8462/8463. HTS 8466.94.85.85 covers this special attachment for machine tools. Enables complex angular positioning for semiconductor boule preparation.
Boule Grinder Flatting Fixture
Custom fixture for grinding orientation flats on semiconductor crystal boules per statistical notes. Designed for heading 8463 grinding machines, under HTS 8466.94.85.85. Ensures conductivity/resistivity indication flats meet industry specs.
Precision Lapper Work Table
Granite/steel work table for wafer lappers maintaining nanometer flatness in prep process. For heading 8463 lapping machines, HTS 8466.94.85.85. Meets statistical note requirements for wafer dimensional tolerances.