CNC Lathe Spindle Motor
High-precision spindle motor designed specifically for CNC lathes under heading 8462, providing rotational power to the chuck holding the workpiece. It falls under HTS 8466.94.85.85 as a part suitable solely or principally for use with machine tools of heading 8462. Essential for high-speed machining operations in semiconductor wafer preparation equipment.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as a general purpose AC motor not dedicated to machine tools
Motors not principally for 8462/8463 machines classify under electric motors chapter based on power rating.
If for use in semiconductor wafer processing machines outside headings 8462-8463
Parts for semiconductor-specific machines unclassified elsewhere go to machines and mechanical appliances heading.
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Import Tips & Compliance
• Verify compatibility certification with specific 8462/8463 machine models to avoid misclassification
• Include detailed technical specs and end-use statements for semiconductor manufacturing to qualify for potential duty relief
• Ensure RoHS compliance documentation as these parts often contain electronic components
Related Products under HTS 8466.94.85.85
Wafer Grinder Spindle Assembly
Precision spindle assembly for wafer grinders used in semiconductor boule preparation, compatible with grinding machines of heading 8463. Classified under 8466.94.85.85 as an accessory principally for heading 8463 machines. Critical for achieving flatness tolerances in crystal grinding per statistical notes.
Crystal Puller Tool Holder
Specialized tool holder for crystal pullers in Czochralski method equipment under heading 8462, holding seed crystals during boule growth. Falls under HTS 8466.94.85.85 as a work/tool holder for 8462 machines. Designed for extreme temperature/precision environments in semiconductor manufacturing.
CNC Grinder Workhead
Complete workhead assembly for CNC grinding machines of heading 8463 used in wafer lapping/polishing prep. Under HTS 8466.94.85.85 as part principally for 8463 grinders. Provides precise rotational control for semiconductor surface flatness.
Wafer Polisher Quill Assembly
Quill/spindle assembly for wafer polishers bringing surfaces to semiconductor fabrication tolerances. For heading 8463 polishing machines, classified 8466.94.85.85. Critical for flatness specs in statistical note wafer preparation equipment.
Czochralski Crystal Seed Chuck
Rotating seed chuck for Czochralski crystal pullers under heading 8462. HTS 8466.94.85.85 as work holder for boule growers. Temperature-controlled interface prevents crystal defects during growth initiation.
Wafer Slicing Saw Arbor
Diamond-impregnated arbor for wafer slicing saws under heading 8463, used to slice monocrystalline boules into wafers. Classified in 8466.94.85.85 as special attachment for 8463 sawing machines. Meets tolerances for semiconductor wafer thickness per statistical notes.