Precision Lapper Work Table from Japan
Granite/steel work table for wafer lappers maintaining nanometer flatness in prep process. For heading 8463 lapping machines, HTS 8466.94.85.85. Meets statistical note requirements for wafer dimensional tolerances.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify flatness to lambda/10 (5nm) with interferometry test reports
• Specify kinematic mounting for wafer cassette interface