Precision Lapper Work Table from Japan
Granite/steel work table for wafer lappers maintaining nanometer flatness in prep process. For heading 8463 lapping machines, HTS 8466.94.85.85. Meets statistical note requirements for wafer dimensional tolerances.
Duty Rate — Japan → United States
14.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify flatness to lambda/10 (5nm) with interferometry test reports
• Specify kinematic mounting for wafer cassette interface