Precision Lapper Work Table from China
Granite/steel work table for wafer lappers maintaining nanometer flatness in prep process. For heading 8463 lapping machines, HTS 8466.94.85.85. Meets statistical note requirements for wafer dimensional tolerances.
Duty Rate — China → United States
42.2%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Certify flatness to lambda/10 (5nm) with interferometry test reports
• Specify kinematic mounting for wafer cassette interface