Semiconductor Wafer Dicing Saw
High-speed dicing saw for singulating individual semiconductor chips from processed wafers using thin kerf blades. While post-processing, classified under 8465.96.00 as slicing machine for hard semiconductor materials.
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More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If includes optical alignment for dicing
Integrated inspection/alignment systems classify as measuring instruments in Chapter 90.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Distinguish from wafer slicing by documenting post-fab dicing application
• Specify spindle RPM and blade specifications for micron precision
• Include chip yield optimization features in technical descriptions
Related Products under HTS 8465.96.00
Wafer Slicing Saw
Precision saw designed to slice thin wafers from monocrystalline semiconductor boules, such as silicon crystals produced by Czochralski method. Classified under HTS 8465.96.00 as a slicing machine for hard materials like semiconductor crystals, aligning with statistical notes for wafer preparation equipment.
Crystal Boule Slicing Machine
High-precision machine using diamond wire or blades to slice semiconductor boules into individual wafers for device fabrication. Falls under 8465.96.00 as a slicing machine specifically for hard materials like silicon and gallium arsenide crystals.
Silicon Ingot Slicer
Automated slicer for cutting silicon ingots into wafers suitable for integrated circuit production, featuring wire saw technology. HTS 8465.96.00 covers this as a slicing machine for hard semiconductor materials per chapter statistical notes.
Gallium Arsenide Wafer Slicing Saw
Specialized slicing saw for compound semiconductors like GaAs boules, maintaining crystal orientation during wafer separation. Classified in 8465.96.00 for slicing hard semiconductor materials as defined in statistical notes.
Diamond Wire Wafer Slicer
Multi-wire diamond saw employing fixed abrasive technology to simultaneously slice multiple wafers from silicon boules. HTS 8465.96.00 includes this slicing machine technology for semiconductor wafer preparation.