Semiconductor Wafer Dicing Saw from Mexico
High-speed dicing saw for singulating individual semiconductor chips from processed wafers using thin kerf blades. While post-processing, classified under 8465.96.00 as slicing machine for hard semiconductor materials.
Duty Rate — Mexico → United States
12.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Distinguish from wafer slicing by documenting post-fab dicing application
• Specify spindle RPM and blade specifications for micron precision
• Include chip yield optimization features in technical descriptions