Semiconductor Wafer Dicing Saw from Canada
High-speed dicing saw for singulating individual semiconductor chips from processed wafers using thin kerf blades. While post-processing, classified under 8465.96.00 as slicing machine for hard semiconductor materials.
Duty Rate — Canada → United States
12.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Distinguish from wafer slicing by documenting post-fab dicing application
• Specify spindle RPM and blade specifications for micron precision
• Include chip yield optimization features in technical descriptions