Semiconductor Wafer Dicing Saw from Germany
High-speed dicing saw for singulating individual semiconductor chips from processed wafers using thin kerf blades. While post-processing, classified under 8465.96.00 as slicing machine for hard semiconductor materials.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Distinguish from wafer slicing by documenting post-fab dicing application
• Specify spindle RPM and blade specifications for micron precision
• Include chip yield optimization features in technical descriptions