Semiconductor Wafer Dicing Saw from Germany
High-speed dicing saw for singulating individual semiconductor chips from processed wafers using thin kerf blades. While post-processing, classified under 8465.96.00 as slicing machine for hard semiconductor materials.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Distinguish from wafer slicing by documenting post-fab dicing application
• Specify spindle RPM and blade specifications for micron precision
• Include chip yield optimization features in technical descriptions