Precision Wafer Back Grinder
Temporary bonded wafer back grinder reducing thickness from 775μm to 50-100μm for 3D IC stacking in advanced semiconductor packaging. Prepares thin wafers.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If sanding/grinding machines primarily
Backside thinning resembles sanding operations in some contexts.
If packaging/testing machines
Semiconductor packaging equipment including thinning in 8486.
If flat panel display processing
Similar thin grinding for LCD substrates classifies differently.
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Import Tips & Compliance
• Document temporary bonding/debonding integration capabilities
• Specify minimum achievable thickness and TTV for advanced node validation
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