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8465.96.00.40/Precision Wafer Back Grinder/Japan

Precision Wafer Back Grinder from Japan

Temporary bonded wafer back grinder reducing thickness from 775μm to 50-100μm for 3D IC stacking in advanced semiconductor packaging. Prepares thin wafers.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document temporary bonding/debonding integration capabilities

• Specify minimum achievable thickness and TTV for advanced node validation

Precision Wafer Back Grinder from Japan — Import Duty Rate | HTS 8465.96.00.40