Precision Wafer Back Grinder from Canada
Temporary bonded wafer back grinder reducing thickness from 775μm to 50-100μm for 3D IC stacking in advanced semiconductor packaging. Prepares thin wafers.
Duty Rate — Canada → United States
12.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document temporary bonding/debonding integration capabilities
• Specify minimum achievable thickness and TTV for advanced node validation