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8465.96.00.40/Precision Wafer Back Grinder/Canada

Precision Wafer Back Grinder from Canada

Temporary bonded wafer back grinder reducing thickness from 775μm to 50-100μm for 3D IC stacking in advanced semiconductor packaging. Prepares thin wafers.

Duty Rate — Canada → United States

12.4%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Document temporary bonding/debonding integration capabilities

• Specify minimum achievable thickness and TTV for advanced node validation