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8465.96.00.40/Precision Wafer Back Grinder/Germany

Precision Wafer Back Grinder from Germany

Temporary bonded wafer back grinder reducing thickness from 775μm to 50-100μm for 3D IC stacking in advanced semiconductor packaging. Prepares thin wafers.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Document temporary bonding/debonding integration capabilities

• Specify minimum achievable thickness and TTV for advanced node validation