Precision Wafer Back Grinder from Germany
Temporary bonded wafer back grinder reducing thickness from 775μm to 50-100μm for 3D IC stacking in advanced semiconductor packaging. Prepares thin wafers.
Duty Rate — Germany → United States
12.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document temporary bonding/debonding integration capabilities
• Specify minimum achievable thickness and TTV for advanced node validation