Precision Wafer Back Grinder from Germany
Temporary bonded wafer back grinder reducing thickness from 775μm to 50-100μm for 3D IC stacking in advanced semiconductor packaging. Prepares thin wafers.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document temporary bonding/debonding integration capabilities
• Specify minimum achievable thickness and TTV for advanced node validation