Rebuilt Silicon Wafer Lapper
Used lapping machine for initial flatness correction on sliced silicon wafers using abrasive slurries. HTS 8463.90.0040 for rebuilt cermet working tools. Prepares wafers for polishing.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If lapping semiconductor wafers
Lappers specifically for flat surfaces including wafers are in 8460.49.
If integrated wafer processing
Wafer lappers listed in statistical note under semiconductor equipment 8486.
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Import Tips & Compliance
• Detail slurry compatibility and platen flatness specs
• Include pressure/thickness control documentation
• Verify rebuild doesn't add polishing capability
Related Products under HTS 8463.90.00.40
Used Wafer Surface Polisher
Rebuilt polisher achieving sub-angstrom surface roughness on silicon wafers for device fabrication. Classifies 8463.90.0040 as used metalworking without removal for semiconductor prep. Critical mirror finish step.
Rebuilt Wafer Back Grinder
Used grinder for thinning wafer backsides to target thickness for device processing. HTS 8463.90.0040 for rebuilt cermet tools. Achieves TTV <1um specifications.
Used Czochralski Crystal Puller
A rebuilt machine used to grow monocrystalline silicon boules from molten silicon via the Czochralski method for semiconductor wafer production. It falls under HTS 8463.90.0040 as a used or rebuilt machine tool for working metal or cermets without removing material, specifically for processing semiconductor materials. This equipment precisely controls crystal growth without material removal.
Rebuilt Float Zone Crystal Grower
A used float zone furnace rebuilt for producing high-purity silicon crystals by zone melting without a crucible. Classified in HTS 8463.90.0040 as other used machine tools for metalworking without material removal, applied to semiconductor crystal processing. Ideal for defect-free boule production.
Used Crystal Boule Grinder
Rebuilt grinder for shaping silicon crystal boules to precise diameters and flats indicating conductivity type. Under HTS 8463.90.0040 for used machine tools working cermets or metal without removal, used in wafer preparation. Ensures boule readiness for slicing.
Rebuilt Semiconductor Wafer Slicing Saw
Used inner-diameter saw rebuilt for slicing thin wafers from monocrystalline silicon boules with minimal kerf loss. HTS 8463.90.0040 covers this as rebuilt metalworking saw without primary material removal intent. Critical for high-yield wafer production.