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8463.90.00.40/Rebuilt Silicon Wafer Lapper/Japan

Rebuilt Silicon Wafer Lapper from Japan

Used lapping machine for initial flatness correction on sliced silicon wafers using abrasive slurries. HTS 8463.90.0040 for rebuilt cermet working tools. Prepares wafers for polishing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Detail slurry compatibility and platen flatness specs

• Include pressure/thickness control documentation

• Verify rebuild doesn't add polishing capability