8463.90.00.40/Rebuilt Silicon Wafer Lapper/Japan

Rebuilt Silicon Wafer Lapper from Japan

Used lapping machine for initial flatness correction on sliced silicon wafers using abrasive slurries. HTS 8463.90.0040 for rebuilt cermet working tools. Prepares wafers for polishing.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Detail slurry compatibility and platen flatness specs

• Include pressure/thickness control documentation

• Verify rebuild doesn't add polishing capability

Rebuilt Silicon Wafer Lapper from Japan — Import Duty Rate | HTS 8463.90.00.40