Rebuilt Silicon Wafer Lapper from Canada

Used lapping machine for initial flatness correction on sliced silicon wafers using abrasive slurries. HTS 8463.90.0040 for rebuilt cermet working tools. Prepares wafers for polishing.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Import Tips

Detail slurry compatibility and platen flatness specs

Include pressure/thickness control documentation

Verify rebuild doesn't add polishing capability