Rebuilt Silicon Wafer Lapper from Germany
Used lapping machine for initial flatness correction on sliced silicon wafers using abrasive slurries. HTS 8463.90.0040 for rebuilt cermet working tools. Prepares wafers for polishing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Detail slurry compatibility and platen flatness specs
• Include pressure/thickness control documentation
• Verify rebuild doesn't add polishing capability