Rebuilt Silicon Wafer Lapper from Mexico
Used lapping machine for initial flatness correction on sliced silicon wafers using abrasive slurries. HTS 8463.90.0040 for rebuilt cermet working tools. Prepares wafers for polishing.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Detail slurry compatibility and platen flatness specs
• Include pressure/thickness control documentation
• Verify rebuild doesn't add polishing capability