Okamoto ACC-3224DXNC Wafer Planing Machine
Numerically controlled planing machine optimized for flattening semiconductor crystal ingots to precise diameters before grinding and slicing into wafers. Classified in HTS 8461.90.3040 as an other numerically controlled planing machine working by removing metal. Critical for achieving the flatness required in Czochralski crystal processing.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If dedicated to semiconductor crystal boule preparation
Statistical notes place crystal grinders/planers for semiconductor materials directly under 8486.40.
If configured for gear shaping rather than planing
Shaping machines for metal removal are in 8460, differing by tool path and workpiece orientation.
If not a planing machine but another NC metalworking type
Other NC machine tools not specified elsewhere go to 8461.90.80.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Provide evidence of planing reciprocation mechanism to distinguish from lapping/polishing under Chapter 84 or 90
• Label as 'numerically controlled' with CNC software details to qualify for 8461.90.30 subheading
Related Products under HTS 8461.90.30.40
Haas VF-4 CNC Heavy-Duty Planer
A robust numerically controlled vertical planing machine for shaping large metal semiconductor components and crystal holders by removing material. Fits HTS 8461.90.3040 for other NC planing machines in metalworking applications. Used in precision preparation stages of wafer manufacturing equipment bases.
DMG Mori NLX 2500/1250 CNC Planing Machine
A numerically controlled planing machine designed for high-precision metal removal on large workpieces in semiconductor manufacturing, specifically for planing crystal boules prior to wafer slicing. It falls under HTS 8461.90.3040 as a numerically controlled planing machine for metalworking, not elsewhere specified. This equipment ensures flatness tolerances critical for downstream wafer processing.
Makino G5-A5G NC Planing Center
Advanced numerically controlled planing center for high-precision surfacing of cermet tools used in semiconductor wafer slicing saws. Under HTS 8461.90.3040 as other NC planing machines for metal/cermet removal. Ensures surface flatness for accurate wafer thickness control.
Doosan Puma 2100 CNC Ingot Planer
Numerically controlled lathe-planer hybrid for planing silicon ingot ends to exact flatness before crystal grinding in wafer production. Classified HTS 8461.90.3040 for specialized NC planing operations on metal semiconductor materials. Vital for float zone and Czochralski boule processing.
Yamazaki Mazak Integrex Planing Module
Modular numerically controlled planing attachment for multi-axis machining centers, used for surfacing large semiconductor crystal puller components. HTS 8461.90.3040 covers this as other NC planing machine for precise metal removal. Supports growth equipment fabrication.