8461.90.30.40/Okamoto ACC-3224DXNC Wafer Planing Machine/Canada

Okamoto ACC-3224DXNC Wafer Planing Machine from Canada

Numerically controlled planing machine optimized for flattening semiconductor crystal ingots to precise diameters before grinding and slicing into wafers. Classified in HTS 8461.90.3040 as an other numerically controlled planing machine working by removing metal. Critical for achieving the flatness required in Czochralski crystal processing.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide evidence of planing reciprocation mechanism to distinguish from lapping/polishing under Chapter 84 or 90

• Label as 'numerically controlled' with CNC software details to qualify for 8461.90.30 subheading

Okamoto ACC-3224DXNC Wafer Planing Machine from Canada — Import Duty Rate | HTS 8461.90.30.40