Doosan Puma 2100 CNC Ingot Planer
Numerically controlled lathe-planer hybrid for planing silicon ingot ends to exact flatness before crystal grinding in wafer production. Classified HTS 8461.90.3040 for specialized NC planing operations on metal semiconductor materials. Vital for float zone and Czochralski boule processing.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If classified primarily as CNC lathe
Lathes for metal removal, even with planing capability, fall under 8458.
If non-NC version of same machine
Loss of numerical control shifts to other planing machines in 8461.90.70.
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Import Tips & Compliance
• Specify ingot diameter capacity matching semiconductor standards (e.g
• 200-300mm)
• Customs binding ruling recommended for hybrid planer-lathe functions
Related Products under HTS 8461.90.30.40
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DMG Mori NLX 2500/1250 CNC Planing Machine
A numerically controlled planing machine designed for high-precision metal removal on large workpieces in semiconductor manufacturing, specifically for planing crystal boules prior to wafer slicing. It falls under HTS 8461.90.3040 as a numerically controlled planing machine for metalworking, not elsewhere specified. This equipment ensures flatness tolerances critical for downstream wafer processing.
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Numerically controlled planing machine optimized for flattening semiconductor crystal ingots to precise diameters before grinding and slicing into wafers. Classified in HTS 8461.90.3040 as an other numerically controlled planing machine working by removing metal. Critical for achieving the flatness required in Czochralski crystal processing.
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