Haas VF-4 CNC Heavy-Duty Planer
A robust numerically controlled vertical planing machine for shaping large metal semiconductor components and crystal holders by removing material. Fits HTS 8461.90.3040 for other NC planing machines in metalworking applications. Used in precision preparation stages of wafer manufacturing equipment bases.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If primarily a milling machine with planing accessories
Milling machines for metal, even NC, classify under 8462 based on rotary cutter use.
If for semiconductor testing apparatus integration
If combined with testing functions for semiconductor devices, it may fall under Chapter 84 machinery NES.
If for gear cutting planers
NC planers specifically for gear finishing are in a separate 8461.90.10 provision.
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Import Tips & Compliance
• Include spindle speed and feed rate specs proving metal removal via planing action
• Customs may require video demo or blueprints confirming NC planing function
• Avoid misdeclaration as milling (8462) by emphasizing linear planing table motion
Related Products under HTS 8461.90.30.40
DMG Mori NLX 2500/1250 CNC Planing Machine
A numerically controlled planing machine designed for high-precision metal removal on large workpieces in semiconductor manufacturing, specifically for planing crystal boules prior to wafer slicing. It falls under HTS 8461.90.3040 as a numerically controlled planing machine for metalworking, not elsewhere specified. This equipment ensures flatness tolerances critical for downstream wafer processing.
Okamoto ACC-3224DXNC Wafer Planing Machine
Numerically controlled planing machine optimized for flattening semiconductor crystal ingots to precise diameters before grinding and slicing into wafers. Classified in HTS 8461.90.3040 as an other numerically controlled planing machine working by removing metal. Critical for achieving the flatness required in Czochralski crystal processing.
Makino G5-A5G NC Planing Center
Advanced numerically controlled planing center for high-precision surfacing of cermet tools used in semiconductor wafer slicing saws. Under HTS 8461.90.3040 as other NC planing machines for metal/cermet removal. Ensures surface flatness for accurate wafer thickness control.
Doosan Puma 2100 CNC Ingot Planer
Numerically controlled lathe-planer hybrid for planing silicon ingot ends to exact flatness before crystal grinding in wafer production. Classified HTS 8461.90.3040 for specialized NC planing operations on metal semiconductor materials. Vital for float zone and Czochralski boule processing.
Yamazaki Mazak Integrex Planing Module
Modular numerically controlled planing attachment for multi-axis machining centers, used for surfacing large semiconductor crystal puller components. HTS 8461.90.3040 covers this as other NC planing machine for precise metal removal. Supports growth equipment fabrication.