Rebuilt Disco DFG8340 Wafer Lapping System

Rebuilt numerically controlled lapping system for semiconductor wafers, achieving sub-micron flatness on silicon substrates using diamond abrasives. Falls under HTS 8460.40.40.10 for rebuilt NC lapping machines finishing metal surfaces.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.4%+35.0%39.4%
🇲🇽Mexico4.4%+10.0%14.4%
🇨🇦Canada4.4%+10.0%14.4%
🇩🇪Germany4.4%+10.0%14.4%
🇯🇵Japan4.4%+10.0%14.4%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8479.82.00Lower: 35% vs 39.4%

If dedicated to semiconductor wafer processing

Chapter statistical notes cover wafer preparation lappers under semiconductor manufacturing machines.

8460.40Same rate: 39.4%

If not numerically controlled

NC is required for .40 subheading; conventional lappers use .20 or .60.

9031.49Lower: 10% vs 39.4%

If primarily for metrology/testing rather than finishing

Precision measuring lappers may shift to optical/instrument chapters.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Submit OEM rebuild certificates and before/after specs to Customs for used/rebuilt verification

Label as semiconductor-specific if applicable, but primary classification remains lapping function

Check for dual-use export controls on precision wafer equipment

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